What materials can be deposited by PECVD electric furnace?

PECVD (Plasma Enhanced Chemical Vapor Deposition) electric furnace can deposit various materials, including but not limited to:

nitrides:
Silicon nitride (SiN): It has excellent dielectric properties, high thermal stability, and low conductivity, and is commonly used as an insulating layer and passivation layer in semiconductor devices.
Titanium nitride (TiN): It has high hardness and good wear resistance, and is commonly used as a surface coating for cutting tools and molds.
Aluminum nitride (AlN): With high thermal conductivity and electrical insulation, it is suitable for electronic packaging and heat dissipation materials.
Oxide:
Silicon dioxide (SiO ₂): a transparent dielectric material with excellent electrical insulation properties and chemical stability, widely used in semiconductor manufacturing and optical coatings.
Aluminum oxide (Al ₂ O3): With high hardness and wear resistance, it is commonly used as a protective coating on ceramic and metal surfaces.
Carbides:
Silicon carbide (SiC): With high hardness, high thermal conductivity, and good chemical stability, it is suitable for applications in high temperature, high pressure, and corrosive environments.
Titanium carbide (TiC): With high hardness and wear resistance, it is commonly used in cutting tools and wear-resistant components.
Silicon:
Amorphous silicon (a-Si): With unique electronic properties, it can be used to produce thin-film solar cells, photodetectors, and display devices.
Polycrystalline silicon: It can be used as an interconnect material for integrated circuits and a highly cross-linked grid structure material.
Diamond like carbon (DLC):
It has similar characteristics to diamond, including high hardness and low friction, and is commonly used in fields such as cutting tools, wear-resistant surfaces, and biomedical implants.
Metal:
Metal films such as aluminum (Al) and copper (Cu) can be used for electrical interconnects, electrodes, and other electronic components.
Other materials:
Inorganic materials such as borides and phosphides, as well as certain organic materials such as polymers, can also be deposited using PECVD technology.
PECVD electric furnace can deposit various materials at lower temperatures by utilizing plasma enhanced chemical vapor deposition process, and has the advantages of fast deposition rate, good film quality, and strong process flexibility. These characteristics make PECVD technology have broad application prospects in multiple fields such as semiconductors, optoelectronics, nanomaterials, biomedicine, aerospace, etc.