Application of multi gas path PECVD electric furnace in the semiconductor industry

The multi gas path PECVD (plasma enhanced chemical vapor deposition) electric furnace has a wide range of applications in the semiconductor industry, mainly reflected in the following aspects:

1. Integrated Circuit Manufacturing
Deposition of high-quality thin films:
PECVD technology is one of the main technologies for manufacturing integrated circuits in the semiconductor industry.
By precisely controlling the process parameters, it is possible to deposit high-quality thin films on the substrate surface, such as dielectrics such as silicon dioxide (SiO ₂) and silicon nitride (Si ∝ N ₄).
These films are used to isolate multiple conductive layers and capacitors, and are an important part of integrated circuit manufacturing.
Improve process efficiency:
Compared with traditional chemical vapor deposition (CVD), PECVD can deposit at lower temperatures, which not only reduces energy consumption but also protects temperature sensitive substrates.
Meanwhile, PECVD provides better control accuracy and finished product quality.

2. Manufacturing of solar cells and photovoltaic modules
Deposition of anti reflection film:
PECVD is a key deposition technology for manufacturing solar cells and photovoltaic modules.
It can uniformly deposit thin films, such as silicon nitride (SiNx) anti reflective films, on wide surface areas such as solar panels or optical glass.
This type of film can fully absorb sunlight, reduce reflection, and protect solar cells from contamination through its passivation effect, thereby improving the photoelectric conversion efficiency of solar cells.
Optimize battery performance:
The generated silicon nitride film contains a large amount of hydrogen, which can effectively passivate dislocations and surface dangling bonds in silicon.
This improves the mobility of charge carriers in silicon wafers, thereby enhancing the overall performance of solar cells.

3. Produce coatings with specific optical properties
PECVD technology is also widely used in the production of coatings with specific optical properties, such as anti reflective coatings, anti reflective coatings, etc.
These coatings can be used for optical products such as sunglasses, colored optical devices, and photometers to improve the optical performance and service life of the products.
In the semiconductor industry, these coatings may be used to protect or enhance the optical properties of semiconductor components.

4. Other applications
Memory and sensors:
PECVD technology is also used to manufacture key thin film layers in data storage devices and various sensors.
Protective coating:
PECVD film can be used as a protective layer to improve the durability of materials in fields such as anti-corrosion and anti-wear.

5、 The advantages of multi gas path PECVD electric furnace
Gas preheating:
Increasing the front-end gas preheating zone results in faster deposition rate and better film formation effect.
Control system:
AIO control system integrates heating control, plasma RF control, gas flow control and vacuum system control into one touch screen for unified centralized adjustment and control.
Automatic pressure balance inside the pipe:
Real time monitoring of pressure inside the pipe and automatic balancing.
Intelligent gas circuit on/off:
Each gas channel can be timed on and off, saving time and effort.
RF power and switch timing control:
Pre set the power level and opening and closing time to achieve automatic operation.

In summary, multi gas path PECVD electric furnaces have broad application prospects and important technical value in the semiconductor industry. With the continuous development and progress of semiconductor technology, PECVD technology will continue to play a more important role in the semiconductor industry.