What are the applications of vacuum coating PECVD electric furnace in the semiconductor industry?

The vacuum coated PECVD (Plasma Enhanced Chemical Vapor Deposition) electric furnace has a wide range of applications in the semiconductor industry, mainly reflected in the following aspects:
Dielectric layer deposition: PECVD technology is widely used to deposit high-quality dielectric layers on semiconductor chips, such as silicon dioxide (SiO ₂) and silicon nitride (Si ∝ N ₄). These dielectric layers play a crucial role in integrated circuits, such as serving as insulation layers, capacitor dielectric layers, or passivation layers to isolate different conductive layers and protect chips from environmental influences.
Gate oxide layer: PECVD technology can be used to deposit high-quality gate oxide layers in the manufacturing process of devices such as MOSFETs (metal oxide semiconductor field-effect transistors). These oxide layers are crucial for controlling the switching speed and stability of transistors.
Stress Adjustment Layer: PECVD technology can also deposit thin films with specific stresses, which are used to adjust the stress distribution in semiconductor devices and optimize their performance. For example, in CMOS (Complementary Metal Oxide Semiconductor) technology, the stress adjustment layer can improve the mobility of charge carriers, thereby enhancing the speed and efficiency of the device.
Diffusion barrier layer: In semiconductor processes, PECVD technology can also be used to deposit diffusion barrier layers to prevent metals or other impurities from diffusing into the semiconductor material in subsequent process steps, affecting the performance and reliability of the device.
Pre – and post fabrication processes: PECVD technology is applied in both pre fabrication processes (such as transistor manufacturing) and post fabrication processes (such as packaging and interconnects) in semiconductor manufacturing. In the later stage of the process, it is often used to deposit passivation layers, sealing layers, or pre-treatment layers before metallization.
3D structure manufacturing: With the development of semiconductor technology towards 3D integration, PECVD technology has also been used to deposit uniform thin films on complex 3D structures to meet the demands of the new generation of semiconductor devices for higher integration and lower power consumption.
Flexible electronics and wearable devices: Although these are mostly emerging application areas, the potential applications of PECVD technology in flexible semiconductor devices and wearable devices are also worth paying attention to. It can deposit high-quality thin films on flexible substrates, providing technical support for these emerging fields.
In short, vacuum coated PECVD electric furnaces play an important role in the semiconductor industry, and their unique process characteristics and wide range of applications make them an indispensable part of the semiconductor manufacturing process. With the continuous advancement and development of semiconductor technology, PECVD technology will continue to evolve and innovate to meet the industry’s demand for higher performance, higher reliability, and lower cost.