Which is more commonly used, CVD furnace or PECVD furnace?

In the field of semiconductor and materials science, CVD furnaces (chemical vapor deposition furnaces) and PECVD furnaces (plasma enhanced chemical vapor deposition furnaces) are commonly used equipment, but their degree of use and application scenarios vary. The following is a clear summary of the commonly used degrees of the two:

1. The degree of common use of CVD furnaces
Widely used: CVD furnace is one of the most widely used technologies in the semiconductor industry, used for depositing various materials, including a wide range of insulation materials, most metal materials, and metal alloy materials.
Mature technology: CVD technology has been developed for many years, with relatively mature technology and stable and reliable processes.
Multiple types: CVD technology includes low-pressure CVD (LPCVD), atmospheric CVD (APCVD), sub atmospheric CVD (SACVD), ultra-high vacuum CVD (UHCVD), and other types, suitable for different process requirements.
Application areas: CVD furnaces are not only used in the semiconductor industry, but also widely used in multiple fields such as optical devices, functional coatings, ceramic materials, etc.

2. The degree of common use of PECVD furnaces
Specific applications: Although PECVD furnaces are also important chemical vapor deposition equipment, their applications are relatively more specific. It is mainly used in scenarios that require low-temperature deposition of high-quality thin films, such as the preparation of optoelectronic materials such as solar cells and LED chips.
Low temperature deposition: PECVD furnaces can achieve high-quality thin film deposition at lower temperatures, which is a major advantage compared to traditional CVD furnaces. However, this also limits its use in certain application scenarios that require high-temperature treatment.
Rapid development: With the rapid development of the optoelectronic industry, the application of PECVD furnaces is also constantly expanding. Especially in the field of solar cells, PECVD furnaces have become important equipment for preparing key materials such as silicon nitride passivation layers.

3. Summary
Overall, CVD furnaces have a higher degree of common use in the fields of semiconductors and materials science due to their wide range of applications and mature technology.
In specific fields, PECVD furnaces are more common in applications such as the optoelectronic industry, especially in scenarios that require low-temperature deposition of high-quality thin films.
The selection criteria, in practical applications, whether to choose a CVD furnace or a PECVD furnace mainly depends on specific process requirements, material characteristics, and application scenarios. For example, when preparing solar cells, PECVD furnaces are highly favored due to their ability to deposit high-quality silicon nitride passivation layers at low temperatures; In other scenarios that require high-temperature treatment, traditional CVD furnaces may be more preferred.