Understand the characteristics of lower annealing furnace together

    Annealing furnace is a process used in the manufacture of semiconductor devices, which includes heating a plurality of semiconductor wafers to affect their electrical properties. Heat treatment is designed for different effects. The wafer can be heated to activate the dopant, convert the film into a film or convert the film into the wafer substrate interface, compact the deposited film, change the state of the growing film, repair the injected damage, move the dopant or transfer the dopant from one film to another or from the film into the wafer substrate. Then the following are the characteristics of annealing furnace:

1. The electric furnace has large loading capacity and high productivity. It is especially suitable for heat treatment and heating of small and medium-sized parts. The energy saving is up to 30%, the furnace temperature is uniform, the intelligent digital display meter PID automatically controls the furnace temperature, and the precision is high;
2. The electric furnace has convenient charging and good working conditions;
3. The sealing between the furnace door and the furnace body is automatic without manual sealing;
4. The electric furnace is equipped with interlocking protection device, which can prevent faults and accidents caused by misoperation.